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Enabling Performance in Harsh Environments
Broad Portfolio of High Temperature Devices
Microchip’s High Temperature technology spans all
product families including Microcontrollers, Analog, and
Memory. Reliability testing is performed to AEC-Q100
Grade 0 (150oC) and specified for operation up to
150oC ambient. This enables robust applications
under-hood, down-hole and in-oven. Visit our High
Temperature Design Center, then select a product
family to see the complete high temperature part listing
in that family, with links to data sheets, application
notes and other information.
Robust Solutions
The challenge to deliver an electronic control module
that complies to stringent, ever changing regulations
that performs reliably in a harsh environment without
adding system overhead costs remain. The importance
of system robustness is well understood. From
peripherals like fail safe clocks to brown out resets
to power on resets to watchdog timers and other,
peripheral integration plays a significant role in our
commitment to deliver robust devices.
Our commitment to improve robustness in our solution
is ongoing. Every new technology and product is
designed with our latest innovations to enhance the
robustness profile of each new device.
Typical Results – Radiated EMI
PIC ? Microcontroller – 8 MHz Internal Oscillator @ 5V Operation
60
BEFORE
Microchip has an excellent track record for developing
devices with excellent ESD rating. As a result, handling
issues in a production environment are less prevalent.
For example, the MCP202X family of LIN transceiver/
SBC family have been designed with aggressive
robustness targets.
48
AFTER
36
24
12
0
-6
Spectrum Analyzer Frequency Sweep (MHz)
10
100
1000
Typical Results – Conductive EMI
PIC ? Microcontroller – 8 MHz Internal Oscillator @ 5V Operation
72
BEFORE
60
48
AFTER
Internal Oscillator
Frequency (8 MHz)
Change in Equipment
Resolution Bandwidth
36
Internal Instruction
Clock Frequency (2 MHz)
24
12
0
Spectrum Analyzer Frequency Sweep (MHz)
0.1
1
10
100
1000
www.microchip.com/hightemp
6
Automotive Capabilities
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相关代理商/技术参数
DM164130-4
功能描述:开发板和工具包 - PIC / DSPIC PICkit 44-Pin Demo Board RoHS:否 制造商:Microchip Technology 产品:Starter Kits 工具用于评估:chipKIT 核心:Uno32 接口类型: 工作电源电压:
DM164130-4
制造商:Microchip Technology Inc 功能描述:PICKIT 44-PIN DEMO BOARD
DM164130-5
功能描述:BOARD EVAL F1 LV PIC21F1/PIC16F1 RoHS:否 类别:编程器，开发系统 >> 通用嵌入式开发板和套件（MCU、DSP、FPGA、CPLD等） 系列:XLP™ 产品培训模块:Blackfin® Processor Core Architecture Overview
Blackfin® Device Drivers
Blackfin® Optimizations for Performance and Power Consumption
Blackfin® System Services 特色产品:Blackfin? BF50x Series Processors 标准包装:1 系列:Blackfin® 类型:DSP 适用于相关产品:ADSP-BF548 所含物品:板，软件，4x4 键盘，光学拨轮，QVGA 触摸屏 LCD 和 40G 硬盘 配用:ADZS-BFBLUET-EZEXT-ND - EZ-EXTENDER DAUGHTERBOARDADZS-BFLLCD-EZEXT-ND - BOARD EXT LANDSCAP LCD INTERFACE 相关产品:ADSP-BF542BBCZ-4A-ND - IC DSP 16BIT 400MHZ 400CSBGAADSP-BF544MBBCZ-5M-ND - IC DSP 16BIT 533MHZ MDDR 400CBGAADSP-BF542MBBCZ-5M-ND - IC DSP 16BIT 533MHZ MDDR 400CBGAADSP-BF542KBCZ-6A-ND - IC DSP 16BIT 600MHZ 400CSBGAADSP-BF547MBBCZ-5M-ND - IC DSP 16BIT 533MHZ MDDR 400CBGAADSP-BF548BBCZ-5A-ND - IC DSP 16BIT 533MHZ 400CSBGAADSP-BF547BBCZ-5A-ND - IC DSP 16BIT 533MHZ 400CSBGAADSP-BF544BBCZ-5A-ND - IC DSP 16BIT 533MHZ 400CSBGAADSP-BF542BBCZ-5A-ND - IC DSP 16BIT 533MHZ 400CSBGA
DM164130-6
功能描述:子卡和OEM板 F1 BDC Motor Add-On
RoHS:否 制造商:BeagleBoard by CircuitCo 产品:BeagleBone LCD4 Boards 用于:BeagleBone - BB-Bone - Open Source Development Kit
DM164130-7
功能描述:子卡和OEM板 F1 Bi-Polar Stepper Motor Add-On
RoHS:否 制造商:BeagleBoard by CircuitCo 产品:BeagleBone LCD4 Boards 用于:BeagleBone - BB-Bone - Open Source Development Kit
DM164130-8
功能描述:子卡和OEM板 F1 Unipolar Stepper Motor Add-On
RoHS:否 制造商:BeagleBoard by CircuitCo 产品:BeagleBone LCD4 Boards 用于:BeagleBone - BB-Bone - Open Source Development Kit
DM164130-9
功能描述:子卡和OEM板 PICkit Low Pin Count Demo Board RoHS:否 制造商:BeagleBoard by CircuitCo 产品:BeagleBone LCD4 Boards 用于:BeagleBone - BB-Bone - Open Source Development Kit
DM164134
功能描述:KIT DEV PIC18F4XK22 RoHS:是 类别:编程器，开发系统 >> 通用嵌入式开发板和套件（MCU、DSP、FPGA、CPLD等） 系列:PIC® 18F 产品培训模块:Blackfin® Processor Core Architecture Overview
Blackfin® Device Drivers
Blackfin® Optimizations for Performance and Power Consumption
Blackfin® System Services 特色产品:Blackfin? BF50x Series Processors 标准包装:1 系列:Blackfin® 类型:DSP 适用于相关产品:ADSP-BF548 所含物品:板，软件，4x4 键盘，光学拨轮，QVGA 触摸屏 LCD 和 40G 硬盘 配用:ADZS-BFBLUET-EZEXT-ND - EZ-EXTENDER DAUGHTERBOARDADZS-BFLLCD-EZEXT-ND - BOARD EXT LANDSCAP LCD INTERFACE 相关产品:ADSP-BF542BBCZ-4A-ND - IC DSP 16BIT 400MHZ 400CSBGAADSP-BF544MBBCZ-5M-ND - IC DSP 16BIT 533MHZ MDDR 400CBGAADSP-BF542MBBCZ-5M-ND - IC DSP 16BIT 533MHZ MDDR 400CBGAADSP-BF542KBCZ-6A-ND - IC DSP 16BIT 600MHZ 400CSBGAADSP-BF547MBBCZ-5M-ND - IC DSP 16BIT 533MHZ MDDR 400CBGAADSP-BF548BBCZ-5A-ND - IC DSP 16BIT 533MHZ 400CSBGAADSP-BF547BBCZ-5A-ND - IC DSP 16BIT 533MHZ 400CSBGAADSP-BF544BBCZ-5A-ND - IC DSP 16BIT 533MHZ 400CSBGAADSP-BF542BBCZ-5A-ND - IC DSP 16BIT 533MHZ 400CSBGA